DSSA to issue bond and sukuk phase III, totalling IDR 2 trillion

JAKARTA – PT Dian Swastatika Sentosa Tbk (DSSA) announces the issuance of Shelf-Registration Bond I of DSSA Phase III Year 2024 and Shelf-Registration Sukuk Mudharabah I of DSSA Phase III Year 2024, with total principal of IDR 2 trillion.

Shelf-Registration Bond I of DSSA Phase III Year 2024 is offered with total principal of IDR 1.5 trillion and is considered a part of Shelf-Registration Bond I of DSSA projected to raise proceeds of total IDR 4.2 trillion.

For this bond phase III issuance, the bond will be offered in 3 series: A, B, and C, with fixed interest rate of 6.875%, 8.25%, and 8.875%, with varied tenors from 370 days to 3 years and 5 years.

Meanwhile, Shelf-Registration Sukuk Mudharabah I of DSSA Phase III Year 2024 is also a part of Shelf-Registration Bond I of DSSA with total principal of IDR 2.8 trillion, and will be offered with total principal of IDR 500 billion.

Similar to the bond, sukuk mudharabah phase III will be issued in 3 series, with profit-sharing yields and tenors set to the equivalent of the bond series.

The public offering will take place from August 28 to 30, 2024, followed with electronic distribution on September 4, 2024, and listing on Indonesia Stock Exchange on September 5.

After acquiring the proceeds from the bond and sukuk issuance, DSSA will utilise a portion of them to pay loan principals owed to banks, while allocating the remaining amount as loans to subsidiaries.

It is worth mentioning that Pefindo has granted an “AA” and “AA (sy)” ratings for this upcoming bond and sukuk of DSSA. The joint lead underwriters for this issuance appointed by DSSA include PT Aldiracita Sekuritas Indonesia, PT BCA Sekuritas, PT BNI Sekuritas, PT Mandiri Sekuritas, PT Trimegah Sekuritas Indonesia Tbk, and PT Indo Premier Sekuritas. (ZH)

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